Touch Screen

Easy Handling and Control with the 6,5" TFT

Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.

3in1 Bond Head

Rotatable Bond Head for changing from dispensing to stamping and placing

HB75’s rotation bond head includes a pickup tool, a stamping tool and an epoxy dispenser.

Pick & Place

with integrated vacuum pump

With the HB75, picking up chips or small parts from the die carrier and its placement on the substrate is simple and accurate.